What are Thermal Interface Materials

There are Thermal Interface Materials available to suit different electronics thermal management requirements. The most common ones include:

Thermal Tapes

It offers high-performance thermal tapes, which are an efficient heat sink attachment method. These tapes eliminate the need for external clamps, reducing the overall hardware requirements. Our thermal tapes are filled with Pressure Sensitive Adhesives (PSAs) coated on support materials such as polyimide film, fiberglass, aluminum foil, or mat. Commonly found on 'sticky' note paper and bandages, PSAs stick to surfaces by contact when slight pressure is applied. Although the primary driver for using thermal tapes is their adhesive property, they have limited applications and are generally not suitable for Ball Grid Array (BGA) packages with concave top surfaces.

Thermal Greases

Thermal greases, also known as thermal compounds, are the oldest class of TIMs, offering an easy solution for filling microscopic air pockets. Despite their high viscosity, which can make them messy and difficult to apply, heating during usage reduces viscosity, allowing greases to wet contact surfaces better, lower interfacial resistance, and improve performance. Ideal for filling very thin interface areas, thermal greases are a reliable choice for various applications.

Thermal Gels

Thermal gels are a recently developed thermal interface option offered used similarly to grease, gels are cured to a partially cross-linked structure to reduce pump-out issues. Their thermal resistance levels are comparable to grease, making them an excellent alternative for various thermal management needs.

Thermal Adhesives

Thermal conductive adhesives, such as epoxy and silicone-based formulations, are often overlooked TIM options. However, they can reduce the size and weight of a system by offering a superior mechanical bond. Thermal adhesives are a high-performing compact thermal interface material package that ensures long-term reliability.

Dielectric Pads

Dielectric pads are in high demand and offered in a wide array of thermal conductivity and dielectric capabilities. These TIMs possess good to very good thermal conductivity and are available with PSA on one side to allow easier manufacturing of mating components. With a thickness range of 5 to 15 mil, dielectric pads are used in smaller size interfaces or strong, larger interfaces due to their relatively hard nature.

Phase Change Materials (PCMs)

At relatively low temperatures ranging from 55-65°C, PCMs change from a solid-state to a viscous liquid. They are generally used as an alternative to grease-type TIMs. Their unique phase-changing characteristic allows easier handling and processing as solids at room temperature while maintaining the conformability and wetting properties of a fluid at higher operating temperatures. In manual assembly processes, PCMs are neater to handle, generally don’t have dry-out issues, and can be pre-applied for future assembly.

Advanced Thermal Materials

It also specializes in advanced thermal materials based on pyrolytic graphite, which has the interesting property of being thermally anisotropic. This quality allows the material to assume different properties in different directions. These graphite-based TIMs can move heat efficiently around the tight confines of portable consumer devices and other components requiring an efficient thermal management solution.