Assembly Materials for Power Modulesee .pdf
- Epoxy Molding Compounds
- Sintering pastes
Form-In-Place CHOFORM® Robotically Dispensed EMI Gasketssee .pdf
- Up to 60% space saved – flanges as narrow as 0.025 in (0.76 mm) can be gasketed.
- Achieve more than 100 dB shielding effectiveness from 200 MHz to 12 GHz with very small gasket beads.
LED componentssee .pdf
- Top LED
- Chip LED
- Lamp LED
Semiconductor products with various functionssee .pdf
- Epoxy Molding Resin
- Photosensitive Overcoat
- Die Attach Paste