• Assembly Materials for Power Module

    • Epoxy Molding Compounds
    • Sintering pastes
    see .pdf 
  • Form-In-Place CHOFORM® Robotically Dispensed EMI Gaskets

    • Up to 60% space saved – flanges as narrow as 0.025 in (0.76 mm) can be gasketed.
    • Achieve more than 100 dB shielding effectiveness from 200 MHz to 12 GHz with very small gasket beads.

    etc.

    see .pdf 
  • LED components

    • Top LED
    • Chip LED
    • Lamp LED

    etc.

    see .pdf 
  • Semiconductor products with various functions

    • Epoxy Molding Resin
    • Photosensitive Overcoat
    • Die Attach Paste
    see .pdf