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HERMETIC PACKAGING
HERMETIC PACKAGING
Die Attach Epoxy Adhesive
Thermal Conductive Materials
Hydrogen Getter & Moisture Absorber
LID for Hermetic Seal Packages
Alloys
Brazing Powder & Paste
Brazing & Soldering Flux
Heat Spreader - arCuDia / SbS-Dia
Thick Film Materials
Decorative Color
Glass Frits
Diamond/Al
LED PACKAGE & LIGHTING
LED PACKAGE & LIGHTING
Silver Paste for LEDs
Solder Materials for Mini LED
ELECTRONIC ASSEMBLY
ELECTRONIC ASSEMBLY
Microwave Absorbing Materials
Bare Chip Bonding Materials
Potting & Encapsulation Materials
Thermal Conductive Material
TIMS Thermal Interface Materials Solutions
Solder Paste
Tacky Solder Flux
Stencil Nano-Coatings
PCB Waterproofing
SEMICONDUCTOR PACKAGING
SEMICONDUCTOR PACKAGING
Bare Chip Bonding Materials
Chip Encapsulation Materials
Underfill
Gap Filler
Anisotropic Conductive Paste & Non-Conductive Paste
MEMS Application
Silver Paste for Semiconductor
Molding Compound for BGA
Die Attach Epoxy Adhesive
Die Attach Film & Dicing Die Attach Film
Hydrogen Getter & Moisture Absorber
Solder Paste
Tacky Solder Flux
TIMS Thermal Interface Materials Solutions
Spin-on-Glass Materials
Backside Protection Film
Back Grind Tape
Dicing Tape
INDUSTRY & ENGINEERING
INDUSTRY & ENGINEERING
Structural Adhesive
Magnet Coatings
OPTICAL COMMUNICATION
OPTICAL COMMUNICATION
Optical fiber Coatings
Diamond/Aluminum Heat Sinks
Sintered Silver Paste
Preform Solder
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Resources
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Home
Products
HERMETIC PACKAGING
Die Attach Epoxy Adhesive
Thermal Conductive Materials
Hydrogen Getter & Moisture Absorber
LID for Hermetic Seal Packages
Alloys
Brazing Powder & Paste
Brazing & Soldering Flux
Heat Spreader - arCuDia / SbS-Dia
Thick Film Materials
Decorative Color
Glass Frits
Diamond/Al
LED PACKAGE & LIGHTING
Silver Paste for LEDs
Solder Materials for Mini LED
ELECTRONIC ASSEMBLY
Microwave Absorbing Materials
Bare Chip Bonding Materials
Potting & Encapsulation Materials
Thermal Conductive Material
TIMS Thermal Interface Materials Solutions
Solder Paste
Tacky Solder Flux
Stencil Nano-Coatings
PCB Waterproofing
SEMICONDUCTOR PACKAGING
Bare Chip Bonding Materials
Chip Encapsulation Materials
Underfill
Gap Filler
Anisotropic Conductive Paste & Non-Conductive Paste
MEMS Application
Silver Paste for Semiconductor
Molding Compound for BGA
Die Attach Epoxy Adhesive
Die Attach Film & Dicing Die Attach Film
Hydrogen Getter & Moisture Absorber
Solder Paste
Tacky Solder Flux
TIMS Thermal Interface Materials Solutions
Spin-on-Glass Materials
Backside Protection Film
Back Grind Tape
Dicing Tape
INDUSTRY & ENGINEERING
Structural Adhesive
Magnet Coatings
OPTICAL COMMUNICATION
Optical fiber Coatings
Diamond/Aluminum Heat Sinks
Sintered Silver Paste
Preform Solder
News
Blog posts
Trade Show
Career
About us
Resources
Brochure
CoolTherm Materials
Microelectronic Materials
FILL OUT REQUEST FORM
Contact
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