American Fairfield Inc.

Sintered Nano-Silver Paste

Sintered Nano-Silver Paste

View full details
  • Solder Replacement

    Substitution for high-temperature lead solder

    Substitution for AuSn solder

  • SiC/GaN power devices

    TO packages, power modules

  • Vertical-Cavity Surface-Emitting Lasers (VCSEL)

    High-power LEDs

1 of 3

The bonding process of Ag sintering paste.

  • Utilization of existing equipment is possible,
  • Pressure-less bonding
  • Same application method as conventional Ag paste
  • Apply low temperature 200-250°C for sintering
  • Curing in air or nitrogen atmosphere