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    American Fairfield Inc.

    Sintered Nano-Silver Paste

    Sintered Nano-Silver Paste

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    Applications

    • Solder Replacement

      Substitution for high-temperature lead solder

      Substitution for AuSn solder

    • SiC/GaN power devices

      TO packages, power modules

    • Vertical-Cavity Surface-Emitting Lasers (VCSEL)

      High-power LEDs

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    The bonding process of Ag sintering paste.

    • Utilization of existing equipment is possible,
    • Pressure-less bonding
    • Same application method as conventional Ag paste
    • Apply low temperature 200-250°C for sintering
    • Curing in air or nitrogen atmosphere

    What else we can offer?

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