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Revolutionizing Double-Sided PCB Assembly: AI T...

Alisher Orazgaliyev

Discover how AI Technology, Inc.'s innovative SAC-based Transient Liquid Phase Sintering (TLPS) solder paste is transforming double-sided PCB assembly by eliminating the need for SMT adhesives. This advancement enhances efficiency...

Revolutionizing Double-Sided PCB Assembly: AI T...

Alisher Orazgaliyev

Discover how AI Technology, Inc.'s innovative SAC-based Transient Liquid Phase Sintering (TLPS) solder paste is transforming double-sided PCB assembly by eliminating the need for SMT adhesives. This advancement enhances efficiency...

The Great Debate: Ball Bonding vs. Wedge Bondin...

Alisher Orazgaliyev

In semiconductor packaging, choosing the right wire bonding technique is crucial for device performance and reliability.This article delves into the two primary methods—ball bonding and wedge bonding—highlighting their differences, advantages,...

The Great Debate: Ball Bonding vs. Wedge Bondin...

Alisher Orazgaliyev

In semiconductor packaging, choosing the right wire bonding technique is crucial for device performance and reliability.This article delves into the two primary methods—ball bonding and wedge bonding—highlighting their differences, advantages,...

Next-Generation Sintering Technology – AIT’s OR...

Alisher Orazgaliyev

AIT’s ORMET® sintering technology is a lead-free, high-performance interconnect solution for semiconductor packaging and power electronics. At American Fairfield Inc., we provide ORMET® conductive pastes for thermal and electrical reliability...

Next-Generation Sintering Technology – AIT’s OR...

Alisher Orazgaliyev

AIT’s ORMET® sintering technology is a lead-free, high-performance interconnect solution for semiconductor packaging and power electronics. At American Fairfield Inc., we provide ORMET® conductive pastes for thermal and electrical reliability...

Advanced Thermal Management with Parker Lord’s ...

Alisher Orazgaliyev

Parker Lord’s COOLTHERM® solutions provide advanced thermal management for semiconductors, EVs, and high-power electronics. At American Fairfield Inc., we supply COOLTHERM® gap fillers, encapsulants, and adhesives to enhance heat dissipation...

Advanced Thermal Management with Parker Lord’s ...

Alisher Orazgaliyev

Parker Lord’s COOLTHERM® solutions provide advanced thermal management for semiconductors, EVs, and high-power electronics. At American Fairfield Inc., we supply COOLTHERM® gap fillers, encapsulants, and adhesives to enhance heat dissipation...

The Future of Sustainable Computing

Alisher Orazgaliyev

Big Tech companies are turning to hydrogen fuel to power AI data centers, reducing energy consumption and carbon emissions. With AI requiring high-performance semiconductor materials, thermal management solutions, and optical...

The Future of Sustainable Computing

Alisher Orazgaliyev

Big Tech companies are turning to hydrogen fuel to power AI data centers, reducing energy consumption and carbon emissions. With AI requiring high-performance semiconductor materials, thermal management solutions, and optical...

China’s AI Breakthrough: How DeepSeek is Reshap...

Alisher Orazgaliyev

China’s DeepSeek AI has surprised global markets, showcasing the nation’s rapid advancements in AI technology and semiconductor independence. As AI growth accelerates, high-performance chips, thermal management materials, and optical communication...

China’s AI Breakthrough: How DeepSeek is Reshap...

Alisher Orazgaliyev

China’s DeepSeek AI has surprised global markets, showcasing the nation’s rapid advancements in AI technology and semiconductor independence. As AI growth accelerates, high-performance chips, thermal management materials, and optical communication...

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