MEMS Sensors and Actuator
Dow silicone hybrids, hotmelts and die-attach film solutions can help optimize designs for MEMS and advanced semiconductor packaging, drive new innovations and meet stringent performance requirements, including thermal stress relaxation, stability over broad temperature and frequency ranges, low moisture uptake, high purity and reliability.
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Liquid die attach adhesives
Achieve stable adhesion to various surfaces with our industry-leading adhesive products. Trust in our expertise for all your bonding needs.
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Encapsulant
Achieve precise controlled flowability with our conformal coating solutions. We ensure spot encapsulation for optimal protection.
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Gel for Potting
Protect your device with our soft gel covers, designed to withstand environmental changes while maintaining functionality.
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Optimize designs for MEMS and advanced semiconductor packaging
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Drive new innovations and meet stringent performance requirements
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Address needs more effectively than organics such as epoxies and polyurethanes
