Exclusive MD-130 | American
Fairfield Inc.

Thermoset® MD-130 adhesive is a specialized one-component micro-electronic adhesive tailored for semiconductor IC packaging applications that do not necessitate electrical conductivity. This adhesive is meticulously formulated to provide robust bonding solutions in environments where precise adhesion and insulation are paramount. Ideal for applications such as semiconductor encapsulation and bonding within micro-electronic devices, Thermoset® MD-130 offers reliable performance and durability. Its one-component design simplifies application processes, ensuring efficient handling and consistent results in semiconductor manufacturing.

Experience the Advanced Capabilities of MD-130 in Electronics

  • Innovative Composition for Superior Results

    The MD-130 is formulated with state-of-the-art technology to deliver exceptional performance in electronic manufacturing. Its unique composition ensures strong adhesion, excellent durability, and superior electrical insulation, suitable for a broad spectrum of electronic applications.

  • Versatile and Adaptable

    The adaptability of MD-130 makes it ideal for various electronic applications, ranging from consumer electronics to more demanding industrial uses. It is engineered to meet the diverse needs of modern electronics, providing reliable results in different environments and applications.

  • User-Friendly Application

    MD-130 is developed to focus on ease of use, ensuring a straightforward and efficient application process. This makes it suitable for professional technicians and hobbyists in electronic assembly and repair.

  • High-Performance Material

    One of the standout features of MD-130 is its capability to perform under challenging conditions. It is designed to enhance the functionality and extend the lifespan of electronic components, making it a reliable choice for high-quality electronic manufacturing.
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Benefits of Using MD-130

  • Enhanced Durability: MD-130 offers a robust bond that significantly enhances the durability and longevity of electronic components.
  • Outstanding Electrical Insulation: It provides excellent insulation, safeguarding against electrical malfunctions and enhancing the safety of electronic devices.
  • Wide Range of Applications: MD-130 is versatile enough to be used in various electronic components and systems, adding to its appeal in the electronics industry.

Technical Specifications:

Thermoset® MD-130 adhesive boasts technical specifications that underscore its suitability for a range of semiconductor IC packaging applications. Featuring a black paste color and a specific gravity of 1.49, this adhesive exhibits excellent electrical insulation with a volume resistivity of 1 x 10^15 ohm-cm at 25°C. Its dynamic viscosity of 60,000 cP at 25°C ensures ease of application, facilitating precise bonding within micro-electronic devices. The adhesive achieves a hardness of 88 and offers thermal conductivity up to 0.42 W/mK at 120°C, making it a reliable choice for applications where thermal management is crucial. With a curing time of 8-24 minutes at 150°C or 160 minutes at 100°C, Thermoset® MD-130 adhesive delivers efficient processing and durable bonding solutions in semiconductor manufacturing environments.


Applications of MD-130

  • PCB Assembly and Repair: Ideal for printed circuit board assembly and repair, ensuring strong bonds and reliable electrical connections.
  • Component Attachment: Perfect for attaching various electronic components, where strong adhesion and electrical insulation are essential.
  • General Electronic Manufacturing: A go-to material for diverse manufacturing processes in the electronics industry.

All About MD-130

Thermoset® MD-130 adhesive is a versatile one-component micro-electronic adhesive designed specifically for semiconductor IC packaging applications where electrical conductivity is not required. It offers several key features and benefits, including fast curing capabilities at temperatures as low as 100°C, ensuring a smooth surface free of pits or voids. With a broad temperature range suitability from -55°C to +130°C, it is ideal for use on components and devices exposed to varying operational conditions. The adhesive provides excellent stability with long room temperature shelf life and high shear strength, ensuring reliable performance over time.

Why Choose MD-130 from American Fairfield Inc.?

MD-130 represents American Fairfield Inc.'s commitment to delivering top-quality electronic materials. Choosing MD-130 means opting for a product that excels in performance, reliability, and user convenience, meeting the highest industry standards.

Get MD-130 from American Fairfield Inc. and upgrade your electronic projects today.

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