Collection: SEMICONDUCTOR PACKAGING
Empower semiconductor innovation with American Fairfield's advanced materials. Our collection includes adhesives, encapsulants, and thermal solutions designed for chip packaging, assembly, and high-reliability applications.

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Indium Thermal Interface Materials(TIM)
Vendor:American Fairfield Inc.Regular price $0.00 USDRegular price -
Electronic Materials by Lord
Vendor:American Fairfield Inc.Regular price $0.00 USDRegular price -
Anisotropic Conductive Paste & Non-Conductive Paste
Vendor:American Fairfield Inc.Regular price $0.00 USDRegular price -
Back Grind Tape by AMC
Vendor:American Fairfield Inc.Regular price $0.00 USDRegular price -
Backside Protection Film by AMC
Vendor:American Fairfield Inc.Regular price $0.00 USDRegular price -
Dicing Tape by AMC
Vendor:AMCRegular price $0.00 USDRegular price -
Die Attach Epoxy Adhesive by AiT
Vendor:American Fairfield Inc.Regular price $0.00 USDRegular price -
Die Attach Film & Dicing Die Attach Film by AiT
Vendor:AITRegular price $0.00 USDRegular price -
Die Attach Film(DAF) by AMC
Vendor:American Fairfield Inc.Regular price $0.00 USDRegular price -
Double Coating Photopatternable Dielectric by PiBond
Vendor:American Fairfield Inc.Regular price $0.00 USDRegular price -
Epoxy Molding Compounds
Vendor:American Fairfield Inc.Regular price $0.00 USDRegular price -
Solder Paste by AIM
Vendor:American Fairfield Inc.Regular price $0.00 USDRegular price

Semiconductor packaging refers to the process of enclosing a semiconductor chip (also called a die) in a protective housing or package that provides electrical connections and physical protection to the chip.
