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Pastes by OKUNO
Vendor:American Fairfield Inc. -
Microwave Absorbing Materials
Vendor:American Fairfield Inc. -
Encapsulate based on Urethane
Vendor:American Fairfield Inc. -
Chip Encapsulation Materials
Vendor:American Fairfield Inc. -
Brazing Powder & Paste
Vendor:American Fairfield Inc. -
Encapsulate based on Silicon
Vendor:American Fairfield Inc. -
TIMS Thermal Interface Materials Solutions
Vendor:American Fairfield Inc. -
PCB Waterproofing Protection
Vendor:American Fairfield Inc. -
LID for Hermetic Seal Package“ELEPHANE®CS”
Vendor:American Fairfield Inc. -
Diamond/Al
Vendor:American Fairfield Inc. -
Anisotropic Conductive Paste & Non-Conductive Paste
Vendor:American Fairfield Inc.

Key features include:
- High thermal conductivity for efficient heat management.
- Low viscosity options for precise application.
- Specialized adhesives with rapid curing capabilities for enhanced productivity.
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