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Diamond/Al

Diamond/Al

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Applications

Power device packaging
RF, microwave, centimeter wave products
- LDMOSFET - HBT - MESFET
- Bipolar - HEMT - MMIC
Laser diode
- Pluse - CW - Single Emitters Bars
Complex machined housing for theproduction of optoelectronic products
- Amplifiers - Receiver - Transmitters
- Tunable Lasers Modulators
Light-emitting diodes and detectors

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Excellent heat dissipation combined with high thermal expansion of semiconductor chips makes DO/Al materials very suitable for use in packaging of microelectronics and optoelectronic products required for high thermal conductivity.

DO/Al composites: Suitable for the manufacture of heat sinks, flanges, housings, laser covers and base plates.

Advantages

Thermal conductivity 500W/mK
CTE matches with different semiconductor materials
Heat sink can be nickel plated or chemical plated
Sample preparation and sample reworkability.

The thermal expansion coefficient of the DO/Al heat sink is perfectly matched to semiconductor chip materials such as Si, GaN, GaAs, and SiC.

Thermal conductivity is as high as 500W/mK and the CTE is only 6.1 ppm/K (40 to 100°C), the DO/Al heat sink can provide a very attractive solution for most packaging types.