American Fairfield Inc.
Encapsulate based on Silicon
Encapsulate based on Silicon
AMERICAN FAIRFIELD INC.
Epoxies Encapsulant
Our epoxies encapsulant are designed to meet the highest standards, confirming to UL rating. They offer low modulus, high-temperature resistance, and high thermal conductivity, making them ideal for a wide range of applications including ordinary encapsulating, ignition coil encapsulating, power module encapsulating, magnetic induction coil encapsulating, and various types of sensor encapsulating.
AMERICAN FAIRFIELD INC.
Silicones Encapsulant
Our silicones encapsulant are formulated to provide excellent protection and performance. They confirm to UL rating and offer low modulus, low viscosity, and high thermal conductivity (0.8-3.2w/mk), making them suitable for general encapsulating, power module encapsulating, and various types of sensor encapsulating.
AMERICAN FAIRFIELD INC.
Urethanes Encapsulant
Our urethanes encapsulant are specially designed for encapsulating various electronic products. They offer superior protection and performance, making them ideal for a wide range of applications.
Variety of Encapsulates
Epoxies Encapsulant
CIRCALOK Series
- CIRCALOK-6007: This product offers high thermal conductivity, high strength, low exotherm, low shrinkage, and is UL94-V0 certified.
- CIRCALOK-6035: With high thermal conductivity and medium strength, this product is UL94-V0 certified and available in red and green variants.
- CIRCALOK-6037: Known for low stress, low shrinkage, and excellent adhesion properties.
- 300 Series: These products can be mixed to achieve different hardness and strength levels.
- 340 Series: Offers high thermal conductivity, medium strength, and is UL94-HB certified.
- 600 Series: These products can be mixed to achieve different hardness, strength, and color options. They also conform to food safety certification standards.
Other Products
- ES-100: Low viscosity, low stress, chemically resistant, and environmentally resistant.
- EL-636: Durable, environmentally resistant, maintains electrical insulation stability at extremely high temperatures.
- EP-20: Low viscosity, low exotherm, excellent heat resistance, chemically resistant, and environmentally resistant.
- EP-96: Fast cure, excellent thermal stability, chemically resistant, shape maintained after dispensing (non-sag).
- EP-6150: Fast cure, excellent thermal stability, chemically resistant, shape maintained after dispensing (non-sag).
- EP-2000: Excellent heat dissipation, low viscosity.
- EP-3500: Durable, excellent heat dissipation, low viscosity.
Silicones Encapsulant
CIRCALOK Series
- CIRCALOK 6702: A thermally conductive silicone encapsulant, red liquid, with high thermal conductivity, excellent thermal shock resistance, and UL94-V0 certified.
- CIRCALOK 6703: A thermally conductive silicone encapsulant, low modulus, with excellent insulation properties, light gray liquid, and UL94-V0 certified.
- CIRCALOK 6705: Silicone encapsulant for electronics components, low viscosity, with excellent insulation properties, black liquid, and UL94-V0 certified.
SC Series
- SC-300M: Low stress, excellent adhesion, durable, with excellent electrical insulation properties.
- SC-305: Thermally conductive silicone encapsulant, high thermal conductivity, excellent thermal shock resistance, gray liquid, and UL94-V0 certified.
- SC-309: Thermally conductive silicone encapsulant, low modulus, low viscosity, with excellent electrical insulation properties, light gray liquid, and UL94-V0 certified.
- SC-315: Thermally conductive silicone encapsulant, low stress, durable, low viscosity, excellent thermal shock resistance, gray liquid, and UL94-V0 certified.
- SC-320: Thermally conductive silicone encapsulant, light pink liquid, high thermal conductive, excellent thermal shock resistance, and UL94-V0 certified.
- SC-320LVH: A two-component system designed to provide excellent thermal conductivity for electrical/electronic encapsulating applications.
- SC-324: Low stress, low viscosity, light pink liquid, durable, excellent thermal shock resistance.
Urethanes Encapsulant
UR Series
- UR-312: A low modulus system designed for the encapsulation of fragile, pressure-sensitive microelectronic components.
- UR-322: Low modulus urethane encapsulant.
- UR-325: Urethane encapsulant with good adhesion and excellent thermal shock resistance.
- UR-340: Urethane encapsulant with low viscosity.
