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    American Fairfield Inc.

    TIMS Thermal Interface Materials Solutions by AIM

    TIMS Thermal Interface Materials Solutions by AIM

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    Thermal Interface Materials Solutions

    Indium is the ultimate thermal management material. It offers exceptional ductility and superior heat dissipation. AIM offers indium as a thermal interface material in various forms including indium wire, custom fabricated indium preforms, and indium foil.

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    • Indium TIM’s

      Standard and custom shapes to fit any package.

    • Indium Foils

      Any width/length/thickness for R&D and pilot scale production.

    • Indium Alloys

      Standard and custom alloys for use as solder-TIM’s

    FEATURES & BENEFITS

    Indium imparts it’s unique properties in many indium solder alloy compositions.  Key properties are:

    • High Thermal Conductivity: >80W/m-k (bulk material)
    • High Ductility: Indium can absorb CTE mismatch between semiconductors & package lids/heat sinks
    • Compliant:  Indium fills gaps and will wet to metallic and non-metallic surfaces

    Indium and indium alloys are the ultimate thermal managementmaterials, offering exceptional ductility and superior heat dissipation.These products are best when utilized in cases where the outgassingof thermal greases is problematic, the conductivity of thermal greasesis insufficient for the heat dissipation needed, or the interface materialneeds to also serve as a mechanical connection. These elementsand alloys are available in powder for fillers, foils¹, wire and customfabricated preforms.

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