American Fairfield Inc.
TIMS Thermal Interface Materials Solutions
TIMS Thermal Interface Materials Solutions
TIMS Thermal Interface Materials Solutions
NON-ADHESIVE OR ONO-ORGANIC IN SUPPORT OF REVOLUTIONARY INTERCONNECT SOLUTIONS IMPROVEMENTS IN THERMAL DISSIPATION
Multicolumn
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As junction resistance values steadily decrease, high performance power applications that use traditional organic based TIMs are quickly approaching their limitations.Solder based TIMs have the high thermal conductivity propertiesfor the next significant TIM interconnect solutions.
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Whether your thermal dissipation improvements focus at the die level (TIM1) or at the interface between the heat spreader/lid to the active or passive heat sink(TIM2), Kester has createdinterconnect solutions to enable your next generation applications.Kester is a global solutions supplier to the Semiconductor Packaging Sector and recently has been a recipient of Intel’s prestigious Supplier Continuous Quality Improvement (SCQI) forthermal interface materials.
