We offer encapsulating materials that meet the requirements of consumer or semiconductor grades, which are characterized by their ease of operation, high reliability, low stress, etc. They can be used for wire-bonding chip encapsulation, smart card encapsulation, or component mounting.
2. One-component, semiconductor grade epoxy designed for the encapsulation of Chip-on-Board (COB) devices
Material filling, fast cure
1. Suitable for high-end ceramic packaging and automotive electronics applications, the underfill of small size chips;
2. Suitable for consumer grade and PCB applications, the underfill of small size chips;
3. Suitable for the underfill of large size, fine pitch chips;
4. High thermal conductive underfill;
5. Suitable for encapsulation of high-density circuit areas in flip-chip packaged devices.