American Fairfield Inc.
Chip Encapsulation Materials
Chip Encapsulation Materials
At American Fairfield Inc., we offer a range of high-quality encapsulating materials designed to meet the stringent requirements of consumer or semiconductor grades. These products are characterized by their ease of operation, high reliability, and low stress, making them ideal for a variety of applications including wire-bonding chip encapsulation, smart card encapsulation, and component mounting.
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Products We Sell
The encapsulating materials we sell are available in both consumer and semiconductor grades, offering unmatched performance and reliability. Whether you need materials for wire-bonding chip encapsulation or smart card encapsulation, the products we sell deliver exceptional results. Key features include ease of operation, high reliability, and low stress characteristics.
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Chip-on-Board (COB) Encapsulants
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Dam & Fill Encapsulants
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Underfills
American Fairfield Inc.
Chip-on-Board(COB) Encapsulants
- EP-937 One-Component Epoxy: Specifically designed for coating semiconductor devices on printed circuit boards, this fast-curing epoxy provides excellent protection and durability.
- ME-430 One-Component Semiconductor Grade Epoxy: Designed for the encapsulation of Chip-on-Board (COB) devices, this epoxy offers superior protection and reliability.
American Fairfield inc.
Dam & Fill Encapsulants
In addition to our standard offerings, we also sell two additional products for Dam & Fill encapsulation:
- ME-455 Material Filling, Fast Cure: This product is ideal for fast curing material filling applications, providing excellent protection and reliability.
- ME-456 Material Lining, Fast Cure: Designed for fast curing material lining applications, this product offers superior protection and reliability.
American Fairfield Inc.
Underfills
We offer a comprehensive range of underfills designed to meet the diverse needs of various applications:
- ME-525: For high-end ceramic packaging and automotive electronics, ideal for small-size chip underfill.
- ME-531: Consumer grade and PCB applications, suitable for small-size chip underfill.
- ME-532: Designed for large-size, fine pitch chip underfill.
- ME-541: Specifically formulated for large-size, fine pitch chip underfill.
- ME-542: High thermal conductivity underfill for heat dissipation.
- ME-543: Ultra-high thermal conductivity, lead-free reflow soldering underfill.
- ME-588: Encapsulation of high-density circuit areas in flip-chip packaged devices.
- ME-5888K: Encapsulation of high-density circuit areas in flip-chip packaged devices..
