Skip to content
Home
Products
Products
THERMAL INTERFACE MATERIALS
THERMAL INTERFACE MATERIALS
Pastes
Gap Filler
Pad
DAF(Die Attache Film)
Wire
Spreader
MOLDING COMPOUND
MOLDING COMPOUND
BGA
Discrete Devices
IPM
Compression
High Reliability L/F
MUF SiP
Epoxy Molding Compound
ALLOY
ALLOY
Aluminum
Silicon - Aluminum
Filler Metals
HERMETIC PACKAGING
HERMETIC PACKAGING
Fibers
Modulator
Adhesive
Solder
Coating
Protection
WAFER BACKSIDE MATERIALS
WAFER BACKSIDE MATERIALS
Film
Tape
Manufacturers
News
About us
Contact
FairField Brochure
Home
Products
THERMAL INTERFACE MATERIALS
Pastes
Gap Filler
Pad
DAF(Die Attache Film)
Wire
Spreader
MOLDING COMPOUND
BGA
Discrete Devices
IPM
Compression
High Reliability L/F
MUF SiP
Epoxy Molding Compound
ALLOY
Aluminum
Silicon - Aluminum
Filler Metals
HERMETIC PACKAGING
Fibers
Modulator
Adhesive
Solder
Coating
Protection
WAFER BACKSIDE MATERIALS
Film
Tape
Manufacturers
News
About us
Contact
FairField Brochure
Search
Cart
Item added to your cart
View my cart
Check out
Continue shopping
Skip to product information
Open media 1 in modal
1
/
of
1
American Fairfield Inc.
Urethane Encapsulant
Urethane Encapsulant
REQUEST A QUOTE
Material
UR-312
UR-322
UR-325
UR-340
Product variants
UR-312 - $0.00
UR-322 - $0.00
UR-325 - $0.00
UR-340 - $0.00
Share
Share
Link
Close share
Copy link
View full details
Subscribe to our emails
Be the first to know about new collections and exclusive offers.
Email
Choosing a selection results in a full page refresh.
Opens in a new window.