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Thermal Conductive Materials
Vendor:American Fairfield Inc. -
Solder Paste
Vendor:American Fairfield Inc. -
Die Attach Epoxy Adhesive
Vendor:American Fairfield Inc. -
Bare Chip Bonding Materials
Vendor:American Fairfield Inc. -
Encapsulate based on Epoxy
Vendor:Parker Lord -
Brazing & Soldering Flux
Vendor:American Fairfield Inc. -
Pastes by OKUNO
Vendor:American Fairfield Inc. -
Encapsulate based on Urethane
Vendor:American Fairfield Inc. -
Chip Encapsulation Materials
Vendor:American Fairfield Inc. -
Brazing Powder & Paste
Vendor:American Fairfield Inc. -
Encapsulate based on Silicon
Vendor:American Fairfield Inc.

Key features include:
- High thermal conductivity for efficient heat management.
- Low viscosity options for precise application.
- Specialized adhesives with rapid curing capabilities for enhanced productivity.
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