Where to use?
Features
-
High Bond Strength
>2500psi
-
Thermal Conductivity
Up to 21.6W/mC
-
Electrical Insulation
Up to 1000 Volts//mil
-
Low Outgassing
ASTM E595
Variations

High Temperature Stability Series
- MC7865
- MC7883
- MC7885
- MC8880
- MC8880-S
High Thermal Conductivity Series
- ME7155-AN
- ME7155-CD
- MC8880-FPSR
High Electrical Conductivity Series
- ME8512
- ME8550
Low Stress Series
- ME7150
- ME7150-SC
- ME7155-DA
- ME7155-M
- ME7156
- ME7159-M
- ME8456
- ME8456-DA

Advanced Die Attach Paste Adhesives for High-Reliability Packaging
ME8412: A hyper-conductive paste that cures in 15 minutes at 150°C and supports wire bonding up to 250°C. It features void-free low BLT, high conductivity, and is MSL Level 1 compliant. Also available in low-viscosity version (ME8412-SLV) for pin-transfer or stamping.
ME7410-SSC: A snap-curing dielectric adhesive, optimized for commercial high-speed die attach processes.
ME7415: A rapid-curing, thermally conductive dielectric adhesive, ideal for reliable high-throughput bonding.
ME8630-SSC: A snap-curing conductive paste that cures in less than 5 minutes at 150°C, or at 60°C for temperature-sensitive applications.
