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American Fairfield Inc.

Die Attach Epoxy Adhesive

Die Attach Epoxy Adhesive

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  • High Bond Strength:

    The Die Attach Epoxy Adhesive by AI Technology Group provides high bond strength to various substrates like gold, silver, copper, aluminum, and stainless steel, which makes it perfect for semiconductor packaging and electronics manufacturing.

  • Superior Thermal Conductivity:

    This epoxy adhesive has superior thermal conductivity and low thermal resistance, allowing it to dissipate heat better than other adhesives. This property is essential in electronic devices where heat needs to be dissipated efficiently.

  • Electrical Insulation:

    The Die Attach Epoxy Adhesive provides electrical insulation, which helps prevent shorts between die and lead frames. It also provides protection against electrostatic discharge (ESD).

  • Fast Curing:

    The adhesive cures quickly at room temperature, reducing the manufacturing time significantly and increasing throughput.

  • Low Outgassing:

    The Die Attach Epoxy Adhesive by AI Technology Group has low outgassing, which reduces the risk of contamination in vacuum systems and space applications.

  • RoHS Compliant:

    The adhesive is RoHS compliant, which means it meets European Union requirements on hazardous substances in electronics.


High Temperature Stability Series

  • MC7865
  • MC7883
  • MC7885
  • MC8880
  • MC8880-S

High Thermal Conductivity Series

  • ME7155-AN
  • ME7155-CD
  • MC8880-FPSR


High Electrical Conductivity Series

  • ME8512
  • ME8550


Low Stress Series

  • ME7150
  • ME7150-SC
  • ME7155-DA
  • ME7155-M
  • ME7156
  • ME7159-M
  • ME8456
  • ME8456-DA