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    American Fairfield Inc.

    Die Attach Epoxy Adhesive by AiT

    Die Attach Epoxy Adhesive by AiT

    Enhance the longevity and rapid curing of your products by utilizing AIT's innovative Die Attach paste adhesives. Our advanced formulas provide precise control over viscosity and thixotropic behavior, making them perfect for automated dispensing and manufacturing.

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    Where to use?

    • Advanced Die Attach Paste Adhesives for High-Reliability Packaging

      These pastes are ideal for large-area die bonding, automated lines, and environments requiring flexible molecular bonding with high electrical/thermal conductivity.

    • Flip Chip & TSV Underfill Adhesives for Advanced Semiconductor Packaging

      These materials support advanced logic, memory, and sensor packaging where standard underfills fail to deliver long-term durability.

    • High-Performance Electrically Conductive Adhesives for Aerospace & Defense

      Certified materials available with documentation upon request, includingNASA outgassing, ISO standards, RoHS, and REACH compliance.

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    Features

    • High Bond Strength

      >2500psi

    • Thermal Conductivity

      Up to 21.6W/mC

    • Electrical Insulation

      Up to 1000 Volts//mil

    • Low Outgassing

      ASTM E595

    Variations

    High Temperature Stability Series

    • MC7865
    • MC7883
    • MC7885
    • MC8880
    • MC8880-S

    High Thermal Conductivity Series

    • ME7155-AN
    • ME7155-CD
    • MC8880-FPSR

    DATA SHEET

    High Electrical Conductivity Series

    • ME8512
    • ME8550

    DATA SHEET

    Low Stress Series

    • ME7150
    • ME7150-SC
    • ME7155-DA
    • ME7155-M
    • ME7156
    • ME7159-M
    • ME8456
    • ME8456-DA

    DATA SHEET

    Advanced Die Attach Paste Adhesives for High-Reliability Packaging

    • ME8412: A hyper-conductive paste that cures in 15 minutes at 150°C and supports wire bonding up to 250°C. It features void-free low BLT, high conductivity, and is MSL Level 1 compliant. Also available in low-viscosity version (ME8412-SLV) for pin-transfer or stamping.
    • ME7410-SSC: A snap-curing dielectric adhesive, optimized for commercial high-speed die attach processes.
    • ME7415: A rapid-curing, thermally conductive dielectric adhesive, ideal for reliable high-throughput bonding.
    • ME8630-SSC: A snap-curing conductive paste that cures in less than 5 minutes at 150°C, or at 60°C for temperature-sensitive applications.

    Flip Chip & TSV Underfill Adhesives for Advanced Semiconductor Packaging

    AIT’s underfill materials are designed for modern packaging architectures including flip chip, stacked dies, and through-silicon vias (TSVs). These formulations ensure stress relief, thermal endurance, and reliability in ultra-thin gaps (25–100 µm).
    UF-MC7880: Developed for flip chip underfill and TSV filling
    UF-MC7883: A replacement for traditional moisture-sensitive underfills