American Fairfield Inc.
Solder Paste
Solder Paste
Solder paste is a type of material used in electronics assembly to join surface mount components to printed circuit boards (PCBs). It consists of a mixture of tiny metal particles, flux and a binder that holds the entire mixture together.
NP545
- Consistent print performance to 0.5AR
- Low QFN/BGA voiding
- Excellent shelf life, 1 year in both refrigerated and room temperature
- Exceptional printing relax & recovery, and printer friendly
NP560
- Classified as ROL0 per J-STD 004B
- Halogen-Free
- Low voiding potential under QFNs
- Excellent activity and printability
- Very low graping
- Reflowable in air and nitrogen conditions
- Wide reflow profile window with good solder-ability on various PCB surface finish
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MP505
- Zero-halogen (none intentionally added)
- Reliable residues in harsh modified SIR testing with forced condensation points
- Reflowable in air and nitrogen
- Consistent print performance to 0.55AR
- Low QFN/BGA voiding
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WP616
- Superior reflow characteristics
- Classified as ORM0 per J-STD-004B
- Excellent activity and printability
- Zero-Halogen (none intentionally added)
- Wide reflow profile window with good solderability
- Reflowable in air and nitrogen conditions
- Cleaning can be accomplished with heated de-ionized water