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NO CLEAN
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WATER SOLUBLE
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ROSIN BASED
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LOW TEMPERATURE
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NO CLEAN
Designed to provide stable transfer efficiencies, powerful wetting, and low voiding, AIM no clean solder pastes address current and future assembly challenges. AIM’s full line of no clean solder paste is available in a wide selection of alloys to meet your process requirements. AIM has partnered with industry cleaner and chemistry manufacturers to ensure residue can be removed when necessary.
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WATER SOLUBLE
This solder paste products have been engineered for powerful wetting and exceptional print performance even in high humidity environments. AIM water soluble paste residues are easily removed with DI water alone up to 48 hours after reflow, even under low stand-off devices. AIM’s formulations provide a low foaming solder paste that can extend closed loop filtration service life. AIM’s water soluble product offerings exceed industry demands for a reliable, low voiding solder paste.
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ROSIN BASED
RMA/RA solder pastes are designed for use where mil spec performance is required. AIM rosin based solder pastes provide modern paste print performance combined with traditional military compliance. Additionally, AIM’s RMA/RA solder pastes can withstand extended hot reflow profiles required for backplane and thermally massive assemblies. AIM’s rosin solder pastes provide superior performance on oxidized or uncleaned surfaces and long pause-to-print capabilities. AIM has partnered with aqueous, solvent and vapor degreaser cleaning manufacturers to ensure residues can be removed with all systems and leave no white residue.
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LOW TEMPERATURE
Low temperature solder pasteoffers exceptional performance combined with peak reflow temperatures as low as 170°C. AIM’s NC273LT solder paste provides 8+ hour stencil life, stable transfer efficiency and excellent wetting, while eliminating solder balling that is common with bismuth bearing pastes.
Other Specialty Solder Solutions
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Solder Preforms
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Thermal Interface Materials
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Sputtering Targets/Thin Film Materials
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Indium
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Gold Tin
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Fusible Alloys
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Solder Preforms
AIM Specialty manufactures solder preforms in all standard and custom alloys, including pure indium, indium alloys, gold-tin, and lead-free alloys. AIM can produce solder preforms in any size/shape, including washers, rectangles, discs, frames, and complex shapes with multiple cut-outs.
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Thermal Interface Materials
Indium is the ultimate thermal management material. It offers exceptional ductility and superior heat dissipation. AIM offers indium as a thermal interface material in various forms including indium wire, custom fabricated indium preforms, and indium foil.
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Sputtering Targets/Thin Film Materials
AIM’s pure indium, Indium-tin metal and Indium Tin Oxide (ITO) are used for sputtering and evaporation of metallic layers of indium as well as transparent conductive layers of ITO (indium tin oxide). Our thin film materials are used in the production of ITO transparent conductors for LCD’s, OLED’s, Electrochromics, and touch screens.
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Indium
AIM is a global leader in the fabrication, supply & recycling of pure indium and indium based products. AIM provides indium consumers with manufacturing, supply, and technical support via our manufacturing sites in the USA, UK, Poland and China.
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Gold Tin
AIM Specialty manufactures Gold-Tin solders for soldering to gold surfaces. AIM’s Au80/Sn20 alloy is composed of 80% gold and 20% tin. Au80/Sn20 is a eutectic alloy with a melting point of 280°C (536°F). AIM offers Au/Sn material in various forms including paste and powder, wire, custom fabricated preforms and foils, bar, ingot & anode forms.
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Fusible Alloys
AIM’s low melt point alloys are used in the aerospace, lens fabrication, safety fuse, electronic and tool/die industries. AIM manufactures fusible alloys with melt points anywhere between 10.7C and 138C.