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American Fairfield Inc.

Thermal Conductive Materials

Thermal Conductive Materials

We offer a wide range of thermal adhesives, thermal gels and thermal greases for heat dissipation (heat conduction) applications of circuit boards and chips.


Thermal Conductive Adhesives

We offer epoxy, silicone, and special resin heat conductive adhesives, with constant temperature / low temperature curing, high strength, high thermal conductivity conductive / non conductive suitable for the application of heat dissipation, such as heat sink, flip chip, transformer, high power LED, etc. for bonding of various materials.

Thermal Conductive Grease

We offer epoxy and silicone thermal conductive grease with high thermal conductivity, high temperature resistance, high reliability, simple operation, suitable for various processes, can be used for the applications requiring heat dissipation such as heat sinks, flip chips, transformer, high power LED, etc.

Thermal Conductive Gap Filler

Thermal Conductive Gap Filler is a type of material designed to fill gaps between heat-generating electronic components and heat dissipating devices like heat sinks or chassis in order to improve thermal conductivity and thermal management. They are commonly used in electronic applications where heat dissipation is critical, such as in LED lighting, automotive electronics, and computer systems.


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Thermal Conductive Gap
Filler: Optimize Heat Transfer Efficiency

American Fairfield Inc. introduces an innovative solution to your heat management challenges: our Thermal Conductive Gap Filler. This cutting-edge material is designed to bridge the gap between heat-producing components and heat sinks or enclosures, significantly enhancing thermal
transfer efficiency.

Advantages of Using Thermal Conductive Gap

  1. Improve Thermal Management: A lower operational temperature is crucial for sensitive electronics.
  2. Vibration Damping: Offers additional benefits such as damping vibrations and contributing to the structural integrity of the device.
  3. Reduced Mechanical Stress: The soft, compressible nature of the Gap Filler minimizes mechanical stress on component solder joints.

Why Our Thermal Conductive Gap Filler is Essential for Your Devices

  • Exceptional Thermal Conductivity

Our Thermal Conductive Gap Filler stands out due to its exceptional thermal conductivity. It's not just an
ordinary material; it's specially engineered with a unique formula designed to promote rapid heat transfer. This means that when electronic components generate heat during operation, our Gap Filler quickly and efficiently conducts that heat away from these components.

This crucial feature ensures that your devices consistently operate within optimal temperature ranges, vital for their performance and longevity. By preventing overheating, our Gap Filler helps electronic components function at their best, whether in a high-performance computer or an industrial machine.

  • Flexibility and Conformity

Another key advantage of our Gap Filler is its flexibility and conformity. Unlike rigid materials, our Gap Filler is inherently flexible and excels at conforming to uneven surfaces. This flexibility is a game-changer, as electronic devices often have complex and irregular shapes. Our Gap Filler fills air gaps completely and compensates for manufacturing tolerances.

This means that it adapts and molds itself to the unique contours of your device, ensuring a perfect fit every time.

  • Ease of Application

The versatility of our Thermal Conductive Gap Filler extends to its ease of application. We understand that different manufacturing processes require different application methods. Whether you're automating the assembly of consumer gadgets or applying it manually in an industrial setting, our Gap Filler is adaptable to your needs. Its user-friendly nature ensures a hassle-free application, saving both time and effort in manufacturing.

Its versatility enables it to be utilized in various electronic devices, ranging from intricate and compact consumer gadgets to sturdy industrial machinery.

  • Enhanced Device Performance and Longevity

Ultimately, our Thermal Conductive Gap Filler is responsible for device performance and longevity. Its primary role is to manage heat, preventing the detrimental effects of overheating efficiently. Doing so significantly enhances your electronic devices'
performance, allowing them to operate consistently at their best.

Moreover, this enhanced thermal management extends the lifespan of your devices by reducing the wear and tear caused by excessive heat. Our Gap Filler is a proactive solution that empowers your devices to deliver exceptional performance and stand the test of time.

Applications of Thermal Conductive Gap Filler
in Electronics

  • LED Lighting Systems: Ensures that high-intensity LEDs remain cool, maintenance brightness and color stability.
  • Computing Hardware: Critical in computer and server cooling processors, GPUs, and power units.
  • Telecommunications Equipment: Helps maintain the operational integrity of device s in high-temperature environments.

Why Choose American Fairfield Inc.’s Thermal
Conductive Gap Filler?

Our Thermal Conductive Gap Filler is not just a product but a comprehensive thermal management solution. It is a testament to American Fairfield Inc.'s commitment to providing advanced materials that address and solve real-world thermal challenges in electronics.

Enhance Heat Transfer – Get Thermal Conductive Gap
Filler Now!

Get a quote for our Thermal Conductive Gap Filler and experience enhanced thermal management in your electronic projects—Trust American Fairfield Inc. to deliver high-quality gap filler solutions that optimize heat transfer efficiency.

Contact Us for Expert Guidance on Using Thermal Conductive Gap Filler in Your Applications!

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