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American Fairfield Inc.

Bare Chip Bonding

Bare Chip Bonding

Bare Chip Bonding

We offer one-component / two-component, conductive / insulating, high thermal conductive, fast curing, low temperature curing, and chip bonding materials. Can be used for bonding of LED, COB, or various IC packaging.


MD-130designed for a variety of semiconductor IC packaging applications where electrical conductivity is not required.

MD-140 - silver-filled conductive adhesive, excellent thermal conductivity, fast cure, suitable for use in thermally demanding die attach applications such as microprocessor, power semiconductor and VLSI assembly.

MD-161 - excellent electrical conductivity, designed for dispensing through small nozzles.

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