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Bare Chip Bonding
We offer one-component / two-component, conductive / insulating, high thermal conductive, fast curing, low temperature curing, and chip bonding materials.
APPLICATION: BONDING OF LED CHIP, COB, VARIOUS IC PACKAGING.
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Chip Encapsulation
We offer ENCAPSULATING MATERIALS that meet the requirements of consumer or SEMICONDUCTOR grades, which are characterized by their ease of operation, high reliability, low stress, etc.
APLICATION: WIRE BONDING, CHIP ENCAPSULATION, SMART CARD ENCAPSULATION, COMPONENTS MOUNTING.
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Thermal Conductive Materials
We offer a wide range of THERMAL ADHESIVES, THERMAL GELS and THERMAL GREASES for heat dissipation (heat conduction)
APPLICATIONS: CIRCUIT BOARDS AND CHIPS
Where it can be used?
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Semiconductor Packaging
Ensuring reliable connections in semiconductor chips and modules.
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Printed Circuit Board (PCB) Assembly:
Providing robust bonding solutions for components on PCBs.
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LED Attachment:
Enhancing the performance and lifespan of LED lights.
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Power Electronics
Ensuring efficient heat dissipation and strong bonds in high-power devices.
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Aerospace and Automotive Electronics
Delivering durability and reliability in demanding environments.
The Importance of Choosing the Right Bonding Materials
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Wide Selection for Diverse Needs
Our range of Bonding Materials includes epoxies, silicones, acrylics, and more, each serving specific purposes in electronic manufacturing. Whether you need high-strength structural bonding, thermal management, or electrical conductivity materials, our collection has the right solution.
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Innovative Formulations for Advanced Applications
The Bonding Materials we offer are developed using the latest technological advancements. They are designed to provide optimal performance in various applications, from consumer electronics to sophisticated aerospace components.
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Customizable Solutions for Your Specific Requirements
Understanding that each project has unique demands, many of our Bonding Materials can be tailored in terms of viscosity, curing time, and thermal and electrical properties to suit specific application needs.
