American Fairfield Inc.
Bare Chip Bonding
Bare Chip Bonding
Bare Chip Bonding
We offer one-component / two-component, conductive / insulating, high thermal conductive, fast curing, low temperature curing, and chip bonding materials. Can be used for bonding of LED, COB, or various IC packaging.
MD-130 - designed for a variety of semiconductor IC packaging applications where electrical conductivity is not required.
MD-140 - silver-filled conductive adhesive, excellent thermal conductivity, fast cure, suitable for use in thermally demanding die attach applications such as microprocessor, power semiconductor and VLSI assembly.
MD-161 - excellent electrical conductivity, designed for dispensing through small nozzles.
