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    Parker Lord

    Electronic Potting & Encapsulation Materials

    Electronic Potting & Encapsulation Materials

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    • Epoxy Encapsulant

      Epoxies provide strength, versatility, durability, adhesion, chemical resistance and high temperature tolerance in adhesive, potting and encapsulant applications.

    • Silicone Encapsulant

      Silicones are one of the most versatile chemistries and offer inherent flexibility spanning over a wide temperature range (-75°C to +200°C). 

    • Urethane Encapsulant

      Urethanes are considered to be a great alternative to silicones when high temperature resistance is not required.

    Epoxy Encapsulant

    These products can be formulated to fit a variety of applications and requirements thanks to the wide availability of raw materials. We offer a wide range of epoxy products from extremely flexible to highly-rigid casting materials, either filled or unfilled, that are thermally and/or electrically conductive and flame retardant.

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    Silicone Encapsulant

    Silicone products are widely known to protect fragile electronic components and modules where flame and high temperature resistance and permanent flexibility are top priorities. We offer platinum-cured, soft silicone and condensation-cured silicone rubbers, either unfilled clear or filled.

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    Urethane Encapsulant

    For electronic packaging, urethanes are known to work best in low-temperature applications. They protect stress-sensitive electronic devices and act as a barrier against water. We offer low viscosity urethane products ranging from soft gels to semi-rigid casting materials that are designed to fit various potting application needs.

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    What else we can offer?

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