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Chip-to-Lead Frame Adhesive
For tantalum capacitors
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Silver Conductive Coating
For printed circuit board repair & electromagnetic shielding applications.
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Conductive Ink
EMI shielding and electrical grounding on plastic and composite substrates
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Protective Coating
For trimmed resistors and general circuit protection.
Chip-to-Lead Frame Adhesive
Features and Benefits:
Application: Can be applied by screen printing, syringe or pin transfer.
Excellent Adhesion – cured film provides excellent mechanical properties with good bonding to a variety of surfaces.
Excellent Conductivity – cured film provides excellent electrical conductivity.
Silver Conductive Coating
Features and Benefits:
Application Diversity – provides excellent rheological properties for either dip or paint applications.
Slow Settling – provides very good resistance to settling; easily mixed after storage.
Excellent Stability – cured film provides excellent electrical and environmental stability both initially and upon aging.
Low ESR – provides low Equivalent Series Resistance (ESR) for tantalum capacitor electrode terminations.
Conductive Ink
Product Features:
- Easy to use, ready to apply
- One component
- Silver filler
- High degree of flexibility
- Withstands wave solder temperatures in excess of 500°F (262°C)
Protective Coating
Features and Benefits:
Application Diversity – can be screen printed onto a variety of substrates.
Durable – cured film is extremely tough and offers protection against thermal shock, moisture, abrasion and oxidation.
Solvent Resistant – cured film is resistant to many commonly used solvents.