American Fairfield Inc.
Heat Spreader - arCuDia / SbS-Dia
Heat Spreader - arCuDia / SbS-Dia
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Features
- High TC: 600 - 1000W/mK
- Low CTE: < 9ppm/K
- Thermal conductivity does not decrease after thermal shock test.
Application
Heat spreader for RF device & electrical vehicle roughness<1.0μm
Key Technologies
- Dimamond Coating Technology
- 3-D dispersion technology
- Multi-layer bonding technology
- Laser & water jet cutting technology
- Machined into holes or ears shape
Dimension
- Width : ~ 108mm
- Length : ~ 108mm
- Thickness : ≥0.7 mm
Features
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- Copper-Carbon New Composite Materials
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- Heat spreader with strain balanced structure
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High performance heat dissipation substrates with higher TC and lower CTE
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- The world's highest performance heat dissipating substrate for semiconductor packages
