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arCuDia
Heat spreader for extreme applications
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SbS-Dia
Heat spreader for extreme applications
Where it can be used?
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CPU, Servers, Internet switches, ASICs, Wearable
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Power Modules for EV & Self-driving
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5G/6G wireless communication
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Aircraft & Aero space communication
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High Power Lasers, Optical communication
arCuDia / SbS-Dia
- Hole, Ear, Rectangular type
- Surface finishing : Cu, Ni, Au
- Ag-Brazing (800℃) is available
- Copper-Carbon New Composite Materials
- Heat spreader with strain balanced structure
- High performance heat dissipation substrates with higher TC and lower CTE
- The world's highest performance heat dissipating substrate for semiconductor packages
