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Home
Products
HERMETIC PACKAGING
Die Attach Epoxy Adhesive
Thermal Conductive Materials
Hydrogen Getter & Moisture Absorber
LID for Hermetic Seal Packages
Alloys
Brazing Powder & Paste
Brazing & Soldering Flux
Heat Spreader - arCuDia / SbS-Dia
Thick Film Materials
Decorative Color
Glass Frits
Diamond/Al
LED PACKAGE & LIGHTING
Silver Paste for LEDs
Solder Materials for Mini LED
ELECTRONIC ASSEMBLY
Microwave Absorbing Materials
Bare Chip Bonding Materials
Potting & Encapsulation Materials
Thermal Conductive Material
TIMS Thermal Interface Materials Solutions
Solder Paste
Tacky Solder Flux
Stencil Nano-Coatings
PCB Waterproofing
SEMICONDUCTOR PACKAGING
Bare Chip Bonding Materials
Chip Encapsulation Materials
Underfill
Gap Filler
Anisotropic Conductive Paste & Non-Conductive Paste
MEMS Application
Silver Paste for Semiconductor
Molding Compound for BGA
Die Attach Epoxy Adhesive
Die Attach Film & Dicing Die Attach Film
Hydrogen Getter & Moisture Absorber
Solder Paste
Tacky Solder Flux
TIMS Thermal Interface Materials Solutions
Spin-on-Glass Materials
Backside Protection Film
Back Grind Tape
Dicing Tape
INDUSTRY & ENGINEERING
Structural Adhesive
Magnet Coatings
OPTICAL COMMUNICATION
Optical fiber Coatings
Diamond/Aluminum Heat Sinks
Sintered Silver Paste
Preform Solder
News
Blog posts
Trade Show
Career
About us
Resources
Brochure
CoolTherm Materials
Microelectronic Materials
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Contact
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American Fairfield Inc.
Back Grind Tape by AMC
Back Grind Tape by AMC
Tape type
APB1
Variant sold out or unavailable
APB2
Variant sold out or unavailable
APB5
Variant sold out or unavailable
AP205
Variant sold out or unavailable
AU130-SC
Variant sold out or unavailable
AUB4
Variant sold out or unavailable
Product variants
APB1 - $0.00
APB2 - $0.00
APB5 - $0.00
AP205 - $0.00
AU130-SC - $0.00
AUB4 - $0.00
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PRODUCT LIST OF
AMC CO.,LTD
Backside Film
Back Grind Tape
Die Attach Film
Dicing Tape
1
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of
4
Back Grind Tape
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Die Attach Film(DAF)
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Backside Protection Film
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Dicing Tape
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