AIT
Die Attach Film & Dicing Die Attach Film
Die Attach Film & Dicing Die Attach Film
Features
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High Bond Strength:
DAF and DDAF provide high bond strength to various substrates like gold, silver, copper, aluminum, and stainless steel, which makes them perfect for semiconductor packaging and electronics manufacturing.
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Easy to Use:
Both DAF and DDAF are made with a pressure-sensitive adhesive and come in a roll form, making them easy to handle, cut, and apply.
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Superior Thermal Conductivity:
DAF and DDAF have superior thermal conductivity and low thermal resistance, allowing them to dissipate heat better than other die attach materials. This property is essential in electronic devices where heat needs to be dissipated efficiently.
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Electrical Insulation:
Both DAF and DDAF provide electrical insulation, which helps prevent shorts between die and lead frames. They also provide protection against electrostatic discharge (ESD).
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Fast Curing:
DAF and DDAF cure quickly at room temperature, reducing the manufacturing time significantly and increasing throughput.
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Low Outgassing:
DAF and DDAF by AI Technology Group have low outgassing, which reduces the risk of contamination in vacuum systems and space applications.
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RoHS Compliant:
Both DAF and DDAF are RoHS compliant, which means they meet European Union requirements on hazardous substances in electronics.
The flash memory 3D packaging suitable for laminated chip process can realize an ultra large capacity, and die attach film (DAF) has become increasingly popular even necessary in laminated chip process.
The main driving force comes from the fact that die attach film(DAF) can provide thinner insulating attached layers and can improve the interfacial stress of laminated chips with bond-line pitches of 8-10 microns or less to achieve a more miniaturized scheme or mobile devices.