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American Fairfield Inc.

Tacky Solder Flux

Tacky Solder Flux

 

Tacky Solder Flux – Achieve Strong, Reliable Solder Connections

Our Tacky Solder Flux is engineered for optimal performance in electronics assembly, providing superior solder flow, enhanced adhesion, and cleaner connections. Designed for ease of use and reliable results, it ensures that solder bonds effortlessly to metal surfaces, promoting better conductivity and long-term durability.

Key Features:

  • High Adhesion: The tacky formula ensures the flux stays exactly where you apply it, making it ideal for precision work on PCB components.
  • Improved Solder Flow: Ensures smooth soldering with minimal defects, improving the overall quality of your connections.
  • Cleaner Joints: Helps remove oxides and impurities from the soldering area, resulting in cleaner and stronger bonds.
  • Versatile Use: Perfect for both automated and manual soldering processes, including surface mount technology (SMT) and repair work.
  • Easy Application: The tacky consistency makes it easy to apply, especially on vertical surfaces or difficult-to-reach areas.

Applications:

  • PCB Assembly: Ideal for use in surface-mount technology (SMT) and through-hole components.
  • Electronics Repair: Perfect for touch-ups and repairs on delicate circuit boards.

Enhance your soldering precision and achieve professional-quality results with Tacky Solder Flux, designed for superior performance and reliable connections in every application.

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Tacky flux - Tacky flux, also known as sticky flux, has a thicker consistency compared to liquid flux. It has a sticky or gel-like texture that helps it adhere to the surfaces being soldered, preventing it from running or dripping. Tacky flux is often used in situations where there is a need for the flux to stay in place during the soldering process, such as when soldering vertical or overhead joints.

When soldering components onto a printed circuit board or other electronic assembly, it is important to keep the components in place during the soldering process to ensure accurate placement and proper electrical connections. Tacky solder flux helps to achieve this by providing a sticky surface that holds the components in place.

Tacky solder flux typically contains rosin, an organic material derived from pine trees, which gives the flux its tacky properties. Other ingredients may be added to the flux to improve its performance, such as solvents to help dissolve oxides on the metal surfaces being joined.

CircuitWorks Tacky Flux is a Type ROL0 formulation designed for BGA rework requiring high-reliability, stability and cleanliness. CircuitWorks Tacky Flux gel composition holds the BGA component in position even with board movement. Its lower viscosity allows easy application and contains no ionic material. CircuitWorks Tacky Flux is suitable for clean room applications.

Soldering Flux

Soldering flux is a chemical cleaning agent used in the soldering process. It is especially useful in automated PCB assembly and hand soldering. Its purpose is to remove oxides and impurities from surfaces before soldering. Flux also acts as an oxygen barrier, preventing subsequent oxidation of the surface.

Using flux improves wetting characteristics of the molten solder. This makes the soldering joints stronger. Good wetting and a clean surface lead to better electrical properties.

Soldering flux is sold in solid, paste or liquid form. Dispensing bottles and pen-shaped dispensers are available. It can also be integrated in the core of soldering wire.

Tacky solder flux is available in various forms, including paste, liquid, and solid form. The paste form is the most common, as it is easy to apply using a syringe or brush. Tacky solder flux also comes in different types, such as no-clean and water-soluble, depending on the specific application requirements.

Types of Flux

  • TSF-WS917

    is a water-soluble tacky soldering flux formula with a unique halogen-free activator system featuring.

  • TSF-6522RH

    is a rosin based, no-clean tacky soldering flux formula designed to be compliant with IEC 61249-2-21 definition for halide-free materials and features.r

  • TSF-ULR18

    is a no-clean, ultra-low residue tacky flux featuring:

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Features

TSF-WS917 

  • 12 month shelf life
  • 24 hour pot life
  • Room temperature storage conditions (0-30°C) Halogen-Free (no intentionally added halogens) Reflowable in air and nitrogen
  • Post reflow residues are easily removed with hot DI water (40°C)
  • Highly active and strong solderability performance Designed to attain stable viscosity even at high temperature staging(up to 50°C)

TSF-6522RH

  • Highly active and good solderability performance
  • High tack values and long tack life
  • 6 month shelf life
  • Halogen-Free formulation
  • Can reflow in air and nitrogen environments
  • Designed for printing and dipping applications

TSF-ULR18 

  • Supports Flip Chip on Lead Frame, Ultra Fine Pitch Cu Pillar Bump and Micro-Solder Bump, 2.5D, 3D Packaging
  • Room temperature storage condition (0-30°C)
  • Post reflow residue of below 10% wt
  • Halogen-Free and Zero-Halogen formulations
  • Long pot life (24 hours)
  • 12 month shelf life
  • Underfill and mold compound compatible
  • Good wetting, solderability and solder bridging performance

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