American Fairfield Inc.
Backside Protection Film
Backside Protection Film
AWD11 BSP by AMC offers a range of advantages for semiconductor manufacturers looking to enhance the yield and reliability of their products. With its superior adhesion, high-temperature resistance, and easy-to-remove characteristics, this product provides a reliable and cost-effective solution for backside protection during the semiconductor manufacturing process.
AWU325 BSP by AMC offers a range of advantages for semiconductor manufacturers looking to enhance the yield and reliability of their products. With its superior adhesion, high-temperature resistance and ease of removal, this product provides a reliable and cost-effective solution for backside protection during the semiconductor manufacturing process.
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AWD11 Backside Protection Film (BSP)
is a high-performance protective film designed specifically for the protection of silicon wafers during the semiconductor manufacturing process. Some of the important advantages of the AWD11 BSP are as follows:
Collapsible content
Enhanced Yield:
The AWD11 BSP provides excellent protection to the backside of the wafer during the manufacturing process, which reduces the number of defects and increases yield. This results in lower costs and improved reliability of the final product.
Superior Adhesion:
The AWD11 BSP has superior adhesion to both the wafer surface and the carrier film. This ensures that it remains in place during transport and processing, minimizing the risk of damage to the wafer during handling.
High-Temperature Resistance:
The AWD11 BSP is designed to withstand high temperatures during the various stages of semiconductor manufacturing, including diffusion, ion implantation, and metalization. This makes it suitable for use in a wide range of applications.
Easy to Remove:
The AWD11 BSP is easy to remove after processing, leaving no residue on the wafer surface. This simplifies the post-process cleaning step and reduces the risk of contamination.
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AWU325 Backside Protection Film (BSP)
is a high-performance protective film that is designed to protect the backside of silicon wafers during the semiconductor manufacturing process. Here are some of the advantages of this product:
Collapsible content
Enhanced Yield:
The AWU325 BSP helps to improve the yield of semiconductor manufacturing by reducing the number of backside defects caused by contamination during handling, processing or storage. This reduces the overall cost of manufacturing and improves the reliability of the devices produced.
Superior Adhesion:
The AWU325 BSP provides excellent adhesion to both the wafer surface and the carrier film, ensuring that it stays in place during transport and processing. This minimizes the risk of damage to the wafer during handling.
High-Temperature Resistance:
The AWU325 BSP is designed to withstand high temperatures, making it suitable for use in a range of semiconductor manufacturing processes, including diffusion, ion implantation, and metalization.
Easy to Remove:
The AWU325 BSP is easy to remove after processing, leaving no residue on the wafer surface. This simplifies the post-process cleaning step and reduces the risk of contamination.