American Fairfield Inc.
Die Attach Film(DAF) by AMC
Die Attach Film(DAF) by AMC
The Die Attach Film (DAF) by AMC is a high-quality adhesive film used in semiconductor device packaging applications. The DAF serves as a bonding material between the die and the substrate, providing essential mechanical support and electrical conductivity.
Features & Benefits
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High Bonding Strength:
The DAF provides exceptionally high bonding strength, ensuring a reliable and secure bond between the die and the substrate. This strength is essential for ensuring optimal performance and long-term reliability of the semiconductor device.
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Excellent Heat Resistance:
The DAF can withstand high temperatures, making it suitable for use in a wide range of semiconductor packaging applications. The film maintains its adhesive properties even under extreme temperature conditions, ensuring a consistent bond between the die and the substrate.
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Easy Application:
The DAF is designed for easy application using traditional die attach equipment, simplifying the packaging process and reducing manufacturing costs. The film is available in a range of thicknesses and sizes, making it suitable for a wide range of semiconductor devices.
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Low Outgassing:
The DAF has low outgassing properties, which reduces the risk of contamination and improves the overall reliability of the semiconductor device. This makes it a suitable choice for use in high-reliability applications such as aerospace and defense.
DAF Structure (Non-UV type)
Die Attach Film (DAF) is a type of adhesive film used in semiconductor packaging to attach the semiconductor die to the substrate or lead frame. The DAF structure for non-UV types typically comprises the following layers:
Collapsible content
Carrier Film:
The carrier film is the base layer of the DAF structure, providing mechanical support during handling and processing. It is usually made of a heat-resistant and dimensionally stable material, such as polyimide.
Adhesive Layer:
The adhesive layer is a key component of the DAF structure and provides the bonding strength between the die and the substrate. The adhesive is typically made of a thermosetting resin, such as epoxy, that can withstand the high temperatures encountered during assembly processes.
Release Liner:
The release liner is a protective layer that covers the adhesive layer on one side of the DAF. It prevents premature adhesion or contamination of the adhesive before the die attachment process.
DAF Structure (UV type)
Die Attach Film (DAF) is a type of adhesive film used in semiconductor packaging to attach the semiconductor die to the substrate or lead frame. In the case of UV-type DAF, the structure may include the following layers:
Collapsible content
Carrier Film:
The carrier film serves as the base layer and provides mechanical support during handling and processing. It is typically made of a heat-resistant material, such as polyimide.
Adhesive Layer:
The adhesive layer is a critical component that creates the bond between the die and the substrate. In UV-type DAF, the adhesive used is photosensitive, meaning it can be cured or activated by exposure to ultraviolet light. This adhesive layer allows for rapid curing under UV irradiation, enabling faster processing times.
Release Liner:
The release liner acts as a protective layer covering the adhesive side of the DAF. It prevents premature adhesion or contamination of the adhesive before the die attachment process.
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Non-UV type
During the die bonding process, the DAF is typically placed between the semiconductor die and the target substrate or lead frame. Heat and pressure are applied to activate the adhesive, causing it to flow and bond the die to the substrate. After bonding, the release liner is peeled off, leaving the die securely attached to the substrate.
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UV type
During die bonding using UV-type DAF, the film is placed between the semiconductor die and the target substrate or lead frame. After proper alignment, UV light is applied to the assembly, which activates the photosensitive adhesive layer, causing it to cure and form a strong bond between the die and the substrate.
