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    American Fairfield Inc.

    Indium Thermal Interface Materials(TIM)

    Indium Thermal Interface Materials(TIM)

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    • Exceptional ductility

    • Superior heat dissipation

    • Mechanical and melting characteristics

    • Excellent fatigue resistance

    • Good for use in high power applications

    • Ingot: Bar sizes from 500 gram to 10kg

    • Shot / Solders / Wire

    • Preforms & Foil/sheets

    • TIMS & Fusible Alloys

    • Powders / Chemicals & Compounds

    • Sputter Targets (ITO & InSn metal)

    FEATURES & BENEFITS

    Relative to other electronic metals, Indium has several properties that make indium a key building block of current and future electronic technologies.  Some of those properties are:

    • High Thermal Conductivity: >80W/m-k
    • High Ductility: Indium remains soft/malleable even at cryogenic temperatures
    • Low Temperature:  Indium Melts at 156.6oC.  Indium alloys have melt points from 10.7oC to >200oC
    • Cold welding:  Pure unoxidized indium will wet to glasses, ceramics & other metals.
    • High Electron Mobility: Indium based III-V compound semiconductors, such as InP
    • Transparent Thin Films: Indium Tin Oxide transparent conductors enable LCD’s and touch screens