1
/
of
0
American Fairfield Inc.
Indium Thermal Interface Materials(TIM)
Indium Thermal Interface Materials(TIM)
Share

AIM is a global leader in the fabrication, supply & recycling of pure indium and indium based products.
Global Manufacturer of Specialty Solder Materials | A Division of AIM Solder
-
Exceptional ductility
-
Superior heat dissipation
-
Mechanical and melting characteristics
-
Excellent fatigue resistance
-
Good for use in high power applications

As devices run at higher powers and the need for thermal managementbecomes greater, solder materials with heat dissipation superior toorganic silicon grease type material are needed. AIM offers a range ofadvanced materials for these types of applications
Thermal foils are alloy laminated foils designed to provide exceptional co-planarity conformity whilereducing oxide content. This yields a consistent, reproducible thermal management interface.
-
Ingot: Bar sizes from 500 gram to 10kg
-
Shot / Solders / Wire
-
Preforms & Foil/sheets
-
TIMS & Fusible Alloys
-
Powders / Chemicals & Compounds
-
Sputter Targets (ITO & InSn metal)
Collapsible content
FEATURES & BENEFITS
Relative to other electronic metals, Indium has several properties that make indium a key building block of current and future electronic technologies. Some of those properties are:
- High Thermal Conductivity: >80W/m-k
- High Ductility: Indium remains soft/malleable even at cryogenic temperatures
- Low Temperature: Indium Melts at 156.6oC. Indium alloys have melt points from 10.7oC to >200oC
- Cold welding: Pure unoxidized indium will wet to glasses, ceramics & other metals.
- High Electron Mobility: Indium based III-V compound semiconductors, such as InP
- Transparent Thin Films: Indium Tin Oxide transparent conductors enable LCD’s and touch screens