American Fairfield Inc.
Double Coating Photopatternable Dielectric
Double Coating Photopatternable Dielectric
PiBond's DDP materials are highly specialized coatings designed for use in semiconductor manufacturing processes. They offer excellent dielectric properties, high resolution patterning, and low thermal shrinkage.
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One of the key benefits of PiBond's DDP materials is their ability to be applied in a double coating process, which enables the creation of highly complex and intricate device structures. This process involves depositing a base layer of DDP material onto a substrate, followed by a second layer that is patterned using photolithography techniques.
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The result is a highly precise and accurate structure that offers excellent electrical performance and reliability. PiBond's DDP materials are ideal for use in a range of semiconductor devices, including microprocessors, memory chips, and power management ICs.
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In addition to their advanced performance characteristics, PiBond's DDP materials are also designed to be highly flexible and customizable. They can be tailored to specific application requirements, including formulations optimized for adhesion, thermal stability, and other important properties.
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Key Advantages
- Sub 1 μm resolution with high sensitivity
- High temperature resistance with nopattern reflow
- Low dielectric constant (k=2.9) andleakage current
- Low shrinkage and stress after cure
- Excellent transmittance across visible and IR wavelengths allowing use also in optical applications
- Good chemical resistance
- Process comparable to positive tone photoresists
