Collection: SEMICONDUCTOR PACKAGING
Empower semiconductor innovation with American Fairfield's advanced materials. Our collection includes adhesives, encapsulants, and thermal solutions designed for chip packaging, assembly, and high-reliability applications.
-
LID for Hermetic Seal Package“ELEPHANE®CS”
Vendor:American Fairfield Inc. -
Silver Paste for Semiconductor
Vendor:American Fairfield Inc.
Semiconductor packaging refers to the process of enclosing a semiconductor chip (also called a die) in a protective housing or package that provides electrical connections and physical protection to the chip.
