Collection: SEMICONDUCTOR PACKAGING
Empower semiconductor innovation with American Fairfield's advanced materials. Our collection includes adhesives, encapsulants, and thermal solutions designed for chip packaging, assembly, and high-reliability applications.

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Spin-on-Glass Materials by PiBond
Vendor:American Fairfield Inc.Regular price $0.00 USDRegular price -
TIMS Thermal Interface Materials Solutions by AIM
Vendor:American Fairfield Inc.Regular price $0.00 USDRegular price -
Flux/Glue/Solder Paste by ShinePure Hi-Tech
Vendor:American Fairfield Inc.Regular price $0.00 USDRegular price -
Thermal Management Materials
Vendor:American Fairfield Inc.Regular price $0.00 USDRegular price -
Materials for MEMS
Vendor:American Fairfield Inc.Regular price $0.00 USDRegular price -
Solder Wire
Vendor:American Fairfield Inc.Regular price $0.00 USDRegular price -
General Purpose Filler
Vendor:American Fairfield Inc.Regular price $0.00 USDRegular price -
Solder Paste for Jet Dispenser by Nihon Handa
Vendor:American Fairfield Inc.Regular price $0.00 USDRegular price -
Preform Solder by Nihon Handa
Vendor:American Fairfield Inc.Regular price $0.00 USDRegular price -
Aluminum Wire/Strip & Gold Wire/Strip
Vendor:American Fairfield Inc.Regular price $0.00 USDRegular price

Semiconductor packaging refers to the process of enclosing a semiconductor chip (also called a die) in a protective housing or package that provides electrical connections and physical protection to the chip.
