American Fairfield Inc. is thrilled to be a proud member and participant at SEMICON West, the premier event connecting leaders in the semiconductor industry. This prestigious trade show highlights cutting-edge advancements in semiconductor technologies, offering a platform to showcase innovations, discuss trends, and foster collaboration among industry experts.
Our Contributions to the Semiconductor Industry
At SEMICON West, American Fairfield Inc. is excited to present our portfolio of advanced materials designed to drive innovation in semiconductor packaging, optical communication, and high-speed electronics.
Featured Products:
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BUF Build-Up Films:
- Thermal Conductivity: Up to 8.0 W/m-K, ensuring efficient heat dissipation.
- Low Dielectric Constant (<2.8): Optimized for high-frequency applications like 5G and 6G communication systems.
- Durability: High lap-shear strength (>25 N/mm²) and moisture resistance (<0.3%), perfect for multi-layer circuit designs.
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Thermal Interface Materials:
- COOL-PAD™ CPR7158: Electrically insulating, low thermal resistance pad for reliable heat management.
- COOL-SILVER™ PAD CPR8850-LB: Non-conductive, compressible phase-change pad for semiconductor and LED applications.
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Hermetic Sealing Tools:
- Deliver airtight and moisture-resistant seals for sensitive electronic components, ensuring long-term reliability in harsh environments.
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Optical Communication Solutions:
- Materials tailored for fiber optics, photonics, and laser technologies, enabling precise signal transmission and reduced loss in communication systems.
Why SEMICON West Matters
SEMICON West serves as a hub for exploring the latest technologies shaping the semiconductor industry, including 3D chip integration, advanced packaging, and AI-driven manufacturing. It provides invaluable networking opportunities and insights into market trends that influence global technology advancements.
As a member of SEMICON West, American Fairfield Inc. is committed to driving the future of semiconductor materials by delivering innovative solutions tailored to industry needs.
Our Vision
At American Fairfield, our mission is to support semiconductor manufacturers, telecommunication providers, and automotive electronics developers with materials that enhance efficiency, reliability, and scalability. Our participation in SEMICON West reinforces our dedication to advancing technology and fostering collaboration with industry leaders.
Connect with Us
Join us at SEMICON West to explore our products and learn how our BUF Build-Up Films, thermal solutions, and sealing tools can elevate your projects. Contact us today to schedule a meeting or learn more about our contributions to the semiconductor industry.
Keywords for Optimization:
- SEMICON West
- Semiconductor packaging materials
- Thermal interface materials
- BUF Build-Up Films
- Optical communication solutions
- High-speed electronics
- 5G and 6G communication systems
- Advanced packaging
