• ACP for RFID application

  • Tire Adhesive Solutions

  • Other Adhesive Solution

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SMERF® Anisotropic Conductive Paste (ACP)

Discover SMERF: The Leading Epoxy Based Anisotropic Conductive Paste for RFID Applications

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  • Smerf, Pastę, Metal, Pastę with metal particle in tube, front side.

    RL04 series

    Standard

  • Smerf, Pastę, Metal, Pastę with metal particle in tube, front side.

    RL05 series

    High reliable type

  • Smerf, Pastę, Metal, Pastę with metal particle in tube, front side.

    RF05 series

    Fast cure type
    (under development)

  • Chemlok® 8007/8210 & 8008/8216

    High-strength adhesives for bonding RFID inlays to the tire interior.

  • Thermoset EP-20

    Used to encapsulate RFID components, offering low viscosity, heat resistance, and long-term protection.

  • LORD® 7701, 7556 A/B, and 7150 A/B

    Ideal for bonding rubber RFID labels to tire sidewalls, providing quick curing, non-yellowing, and ease of use.