
RFID & Printed Electronics Solution
Maximize efficiency with our advanced antenna technologies for RFID, 5G, and industrial applications. Enhance connectivity with our cutting-edge solutions.
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ACP for RFID application
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Tire Adhesive Solutions
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Other Adhesive Solution
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SMERF® Anisotropic Conductive Paste (ACP)
Discover SMERF: The Leading Epoxy Based Anisotropic Conductive Paste for RFID Applications
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RL04 series
Standard
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RL05 series
High reliable type
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RF05 series
Fast cure type
(under development)

Discover our cutting-edge tire adhesive solutions for RFID applications, spikes, studs, valves, and more. Elevate your tire manufacturing process today.
Tire Adhesive Solutions
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Chemlok® 8007/8210 & 8008/8216
High-strength adhesives for bonding RFID inlays to the tire interior.
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Thermoset EP-20
Used to encapsulate RFID components, offering low viscosity, heat resistance, and long-term protection.
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LORD® 7701, 7556 A/B, and 7150 A/B
Ideal for bonding rubber RFID labels to tire sidewalls, providing quick curing, non-yellowing, and ease of use.

Discover our high-performance structural adhesive solutions for RFID integration, die bonding, foam attachment, and component sealing. Optimize your assembly process with reliable, flexible, and durable bonding technologies built for advanced electronics and smart manufacturing.
Other Adhesive Solutions