
SMERF® Anisotropic Conductive Paste (ACP)
Discover SMERF: The Leading Epoxy Based Anisotropic Conductive Paste for RFID Applications
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RL04 series
Standard
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RL05 series
High reliable type
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RF05 series
Fast cure type
(under development)
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Chemlok® 8007/8210 & 8008/8216
High-strength adhesives for bonding RFID inlays to the tire interior.
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Thermoset EP-20
Used to encapsulate RFID components, offering low viscosity, heat resistance, and long-term protection.
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LORD® 7701, 7556 A/B, and 7150 A/B
Ideal for bonding rubber RFID labels to tire sidewalls, providing quick curing, non-yellowing, and ease of use.