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Hard Solder
Wafers(disks or frames, etc.), strips, balls, lines, spindles, etc.
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Soft Solder
Lines, strips, balls, wafers, spindles, etc.
Application
● Sealed ceramic packaging
● Bonding of compound semiconductor chips
● Bonding of ceramic substrate and heat sink
● Used as evaporation material on the back of the chip
Application
● Chip bonding of power devices
● Chip bonding and component assembly of compound semiconductors and optics
● Sealing of multiple packaging