Wafer-Level Packaging & Die Attach – American Fairfield Inc.

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Wafer-Level Packaging & Die Attach

Backgrinding Process Essentials: Polishing and Stress Relief Techniques Explained.

Die Attach Materials

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Underfill & TSV Fill Materials

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Build-Up Films

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Wafer Protection Films

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Encapsulants & Stress Relief Materials

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Indium Thermal Interface Materials(TIM)

Indium Thermal Interface Materials(TIM)

Vendor:
American Fairfield Inc.
Electronic Materials by Lord

Electronic Materials by Lord

Vendor:
American Fairfield Inc.
Anisotropic Conductive Paste & Non-Conductive Paste

Anisotropic Conductive Paste & Non-Conductive Paste

Vendor:
American Fairfield Inc.
Back Grind Tape by AMC

Back Grind Tape by AMC

Vendor:
American Fairfield Inc.
Backside Protection Film by AMC

Backside Protection Film by AMC

Vendor:
American Fairfield Inc.
Dicing Tape by AMC

Dicing Tape by AMC

Vendor:
AMC

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Multiplying Wafer Processing Throughput: Wafer Processing Adhesive on Disposable Carrier

Temporary Bonding Adhesive Solutions with Clean Release De-Bonding: Backgrinding and 3D Wafer Processing

Wafer Processing for High Topography Bumped Wafers:Conforming, Stress-Free Temporary Bonding Adhesive

Backgrinding Wax Adhesive Solutions for SiC, Sapphire and GaAs Wafers

Multiplying Wafer Backgrinding Throughput: Backgrinding Temporary Bonding Adhesive on Disposable Carrier

Laser De-Bonding, High Tg, Temporary Bonding Adhesive Solutions

Molding Release Adhesive Tapes for Wafer and Panel Level Processing (FOWLP and FOPLP) and Heterogeneous Integration Molding