Why Choose our Adhesive Solutions for Electronics?
We specialize in developing world-class thermal management, semiconductor packing, potting, and thick film materials for electronic applications. Our product portfolio and technical expertise include multiple chemistries, namely urethanes, epoxies, and silicones. This product and expertise diversity allows us to select the chemistry that is the best fit for our customers' performance and cost requirements.
With applications in heat sinks, circuit boards, and a wide variety of other electronic devices, our solutions provide electrical insulation, structural strength and protection.
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Thermal Management Materials
Learn MoreTransfer heat out of electronic devices and protect sensitive electronics with thermally conductive adhesives, gap fillers and foams.
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Potting & Encapsulation
Learn MoreOptimize heat dissipation with thermally conductive, low-viscosity potting and encapsulants for electronic applications.
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Semiconductor Packaging Materials
Learn MoreDie attach adhesives, encapsulants, underfills and thermal interface materials for assembly and packaging.
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Thick Film Materials
Learn MoreTrust in durable, electrically conductive thick film materials for electronic applications.
