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American Fairfield Inc.
Silicon-Aluminum Alloy
Silicon-Aluminum Alloy
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Components made from Osprey® CE (controlled expansion) alloys improve product performance and reliability in many areas.
Where it can be used?
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Thermal management products
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Structural products
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Wafer products

Typical applications include stiff structural products, thermal management product, and wafers.

Thermal management products
In aerospace, space and telecommunications applications, controlled expansion alloys can be used in thermal management and electronic packaging components such as:
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HOUSINGS
Amplifier Housing
Optical Housing
Radar Circuitry
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MODULES
RF Transmit Module
Transmit Receive
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BARS & TUBES
PCB Guide Bars
Resistor Tubes
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PLATES & MOUNTS
Carrier Plates
Sensor Mounts
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OTHER
Hybrid Electronic Packages
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Structural products
Stiff structural products are used in, for example, optical systems, electronics assembly, and semiconductor processing equipment. Examples of such products include:
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BEARING HOUSINGS
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LENSE HOLDERS
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SEMICONDUCTOR CHUCKS
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Wire bonders and other products for use in rapid-moving equipment
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Wafer products
Wafers up to 12” diameter supplied as lapped, polished or polished and metallized wafers, expansion matched to compound semiconductor materials. Alloys chosen are typically Osprey® CE6F and CE7F, and these are used to replace sapphire – GaAs. Our alloy wafers are used for medium and high brightness LED, and photovoltaic cells.
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INDUSTRIAL & ENGINEERING
Optimize your projects with American Fairfield's industry-leading solutions. Our range includes thermal...
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HERMETIC PACKAGING
Discover cutting-edge solutions at American Fairfield. Our high-performance materials—thermal adhesives, soldering products,...
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ELECTRONIC & ASSEMBLY
Explore our premium Electronic Assembly Materials, engineered to meet the highest industry...
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