Where it can be used?
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Thermal management products
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Structural products
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Wafer products

Thermal management products
In aerospace, space and telecommunications applications, controlled expansion alloys can be used in thermal management and electronic packaging components such as:

Structural products
Stiff structural products are used in, for example, optical systems, electronics assembly, and semiconductor processing equipment. Examples of such products include:

Wafer products
Wafers up to 12” diameter supplied as lapped, polished or polished and metallized wafers, expansion matched to compound semiconductor materials. Alloys chosen are typically Osprey® CE6F and CE7F, and these are used to replace sapphire – GaAs. Our alloy wafers are used for medium and high brightness LED, and photovoltaic cells.
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INDUSTRIAL & ENGINEERING
Optimize your projects with American Fairfield's industry-leading solutions. Our range includes thermal...
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HERMETIC PACKAGING
Discover cutting-edge solutions at American Fairfield. Our high-performance materials—thermal adhesives, soldering products,...
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ELECTRONIC & ASSEMBLY
Explore our premium Electronic Assembly Materials, engineered to meet the highest industry...