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Disc pellet
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Square pellet
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Tape
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Wire
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Embossed tape packing
Die bonding of power devices such as power modules, semiconductor IC, and sealing medium.
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Features
- A high-p urity a lloy i s used , and dissolved g as, wh ich is one of the causes of voids, is removed by vacuum refining method (DG processing) (only products including Pb).
- There is no dirt, oil content, oxide, or scratch on the surface, and good wettability is provided.
- As it has good slipping property, there is no adhesion between solder.
- The product has been used in many products that require high reliability such as on vehicle material and industrial machinery.