Meet American Fairfield Inc. at SPIE Photonics West – Shaping the Future of Photonics & Semiconductor Innovation!
We are excited to announce that American Fairfield Inc. will be an exhibitor at SPIE Photonics West 2025, one of the leading global events for photonics, lasers, and optical communication technologies. This event is a great opportunityfor engineers, researchers, and industry leaders to explore cutting-edge solutions and tackle key challenges in semiconductor applications.
What to Expect at Our Booth?
At American Fairfield Inc., we specialize in high-performance materials for photonics and semiconductor packaging, including:
✅ BUF Build-Up Films – Ideal for high-speed optical communication and semiconductor packaging.
✅ Thermal Interface Materials – Efficient heat dissipation solutions for high-power laser applications.
✅ Hermetic Sealing Tools – Advanced protection for photonics and precision electronics.
Why Meet Us at SPIE Photonics West?
✅ Industry Networking – Connect with global leaders, including Hamamatsu Photonics, Amazon Robotics, and top semiconductor innovators.
✅ Application-Specific Solutions – Discuss your challenges and let our experts recommend custom material solutionsfor optical communication, laser technologies, and semiconductor packaging.
✅ Live Demonstrations & Insights – Learn about our latest materials, coatings, and packaging solutions designed to enhance photonics applications.
Join Us at SPIE Photonics West!
📅 Event Date: January 28, 2025 - January 30, 2025
📍 Location: BOOTH #2622, Moscone Center, San Francisco, CA
