Revolutionizing Semiconductor Packaging & Power Electronics
As semiconductor technology advances, the demand for high-performance interconnect materials has surged. AI Technology Inc. (AIT)’s ORMET® sintering technology offers a groundbreaking solution for lead-free die-attach applications, high-power modules, and semiconductor packaging. At American Fairfield Inc., we support industries by providing reliable and advanced interconnect materials that enhance thermal and electrical performance.
What is ORMET®?
ORMET® Conductive Paste is an innovative sintering material designed for high-reliability interconnects in semiconductor packaging and power electronics. Unlike traditional soldering or conductive adhesives, ORMET® offers low-temperature sintering, high thermal and electrical conductivity, and long-term reliability in extreme environments.
Key Benefits of AIT’s ORMET® Sintering Technology
✅ Lead-Free & RoHS Compliant – Environmentally friendly, eliminating lead-based solders.
✅ High Thermal Conductivity – Provides superior heat dissipation compared to traditional solders.
✅ Low-Temperature Sintering – Reduces stress on delicate semiconductor components.
✅ High-Strength Interconnects – Ensures long-term durability and reliability in power electronics.
Applications of ORMET® Conductive Pastes
🔹 Semiconductor Packaging – Provides robust, high-conductivity interconnects for advanced chip designs.
🔹 Power Electronics – Used in high-power modules, inverters, and energy conversion systems.
🔹 5G & High-Frequency Devices – Supports low-loss signal transmission in RF applications.
🔹 Automotive & Aerospace Electronics – Ensures reliability in harsh operating conditions.
Why Choose American Fairfield Inc. for AIT’s ORMET® Products?
At American Fairfield Inc., we bring the latest sintering technology to our customers, ensuring high-performance interconnect solutions for advanced electronics. Whether you are designing power modules, semiconductor packages, or high-reliability interconnects, ORMET® provides the best solution for thermal and electrical conductivity.
➡ Contact us today to explore how AIT’s ORMET® conductive pastes can elevate your semiconductor packaging and power electronics.
