Enhancing Performance and Reliability in Electronics & Power Applications
In today’s fast-evolving electronics, automotive, and power electronics industries, effective thermal management is critical. Parker Lord’s COOLTHERM® solutions offer cutting-edge thermal interface materials (TIMs) and encapsulants that enhance heat dissipation, improve performance, and extend product lifespan. At American Fairfield Inc., we supply high-performance thermal solutions to support the most demanding applications in semiconductor packaging, power modules, and electric vehicles (EVs).
What is COOLTHERM®?
COOLTHERM® materials are a range of high-performance thermal interface materials (TIMs), gap fillers, encapsulants, and adhesives designed for efficient heat transfer in high-power applications. These products help reduce thermal resistance, improve component reliability, and optimize performance in power electronics, automotive systems, and industrial devices.
Key Benefits of Parker Lord’s COOLTHERM® Solutions
✅ Superior Thermal Conductivity – Ensures efficient heat dissipation for high-power electronics.
✅ Long-Term Reliability – Designed for harsh environments with excellent moisture and chemical resistance.
✅ High Dielectric Strength – Provides electrical insulation while maintaining thermal efficiency.
✅ Optimized for Automotive & Industrial Applications – Ideal for EV powertrains, battery modules, and semiconductor packaging.
Applications of COOLTHERM® Thermal Management Solutions
🔹 Semiconductor Packaging – Improves thermal performance in high-power chip designs.
🔹 Electric Vehicles (EVs) – Used in battery modules, inverters, and power electronics to ensure efficient cooling.
🔹 Aerospace & Industrial Electronics – Provides long-term thermal stability in high-reliability applications.
🔹 LED & Display Technologies – Helps reduce heat buildup, improving device efficiency and lifespan.
Why Choose American Fairfield Inc. for Parker Lord’s COOLTHERM® Products?
At American Fairfield Inc., we provide best-in-class thermal management solutions tailored to your specific power electronics and semiconductor applications. Whether you need gap fillers, encapsulants, or adhesives, we ensure your designs achieve optimal performance and reliability.
