Achieving Electrical Isolation with Insulating Adhesives

Achieving Electrical Isolation with Insulating Adhesives

Electrical isolation is imperative in certain areas of semiconductor device construction to prevent short circuits, crosstalk, and leakage currents that can undermine performance.

As leaders in advanced bonding and encapsulation solutions, American Fairfield provides specialty insulating adhesives customized to safely embed components, seal terminals, and insulate substrates while securing mechanical integrity.

What are Insulating Adhesives?

Insulating adhesives contain electrical non-conductors such as epoxy, silicone, polyimide, or polyurethane polymers that form solid bonds upon curing without passing an electrical current. This makes them suitable for:

  • Die to attach in power electronic modules - Electrically isolates the bottom die surface from the substrate
  • Conformal coatings over PCBs – Protects tracks from environmental damage
  • Edge bonding of sensors – Insulates contact pads from module walls
  • Potting of terminals and connectors – Prevents arcing and leakage

Insulating Adhesives for Electrical Isolation Applications

With expertise across industries, American Fairfield delivers a diverse range of insulating adhesive chemistries compatible with common semiconductor substrates and components.

●       Epoxy Adhesives

Offer resilient mechanical bonds, electrical resistance, and outstanding adhesion, chemical resistance, and temperature stability. One-part heat cure or two-part room temperature cure options.

●       Silicone Adhesives

These are softer bonds with excellent dielectric strength, wide operating temperatures, and flex resistance. It cures at room temperature into a durable rubber, leading to easy dispensing.

●       Polyurethanes (PURs)

Polyurethane potting compounds protect against abrasion, vibration, and thermal cycling while securing components. Range of shore hardness available.

Our technical teams assess assembly challenges to recommend suitable insulating adhesive materials and dispense methods for reliable, void-free bonds in your specific application. Beyond standard specifications, we also offer custom formulation and property enhancement services.

Technical Considerations for Insulating Adhesives

For adhesives to effectively bridge electrical isolation needs with mechanical bonding in mission-critical systems, parameters like dielectric strength, thermal conductivity, CTE matching, outgassing, and process compatibility need careful evaluation:

1.      Dielectric Breakdown Strength

Indicates the maximum electric field strength tolerated before conduction. Higher is safer for isolation.

2.      Volume Resistivity and Dielectric Constant

Materials with high resistivity (low Dk) impede current flow.

3.      Thermal Conductivity

Dissipates heat generated during operation. Important for temperature-sensitive devices.

4.      Coefficient of Thermal Expansion (CTE)

Closer CTE matching between adhesive, components, and substrate minimizes thermal stresses and bond deterioration.

5.      Outgassing

Released gases during cure can deposit inside microelectronics, affecting reliability.

6.      Work-Life, Viscosity, and Cure Conditions

A balanced work-life, viscosity, and cure conditions match the production process needs for effective bonding and isolation.

Trust American Fairfield’s Expertise

Electrical isolation is vital for optimizing semiconductor and electronics performance. As a leading specialist, American Fairfield provides in-depth knowledge and premium products to implement insulating adhesives across bonding, coating, and potting challenges.

Contact our engineers today to find the right solution for your application requirements!

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