In the ever-evolving landscape of semiconductor packaging and PCB assembly, technological advancements continue to drive efficiency and reliability. A notable innovation in this realm is the introduction of AI Technology, Inc.'s SAC-based Transient Liquid Phase Sintering (TLPS) solder paste, designed to enhance double-sided PCB assemblies by eliminating the need for surface mount technology (SMT) adhesives.
Traditional Challenges in Double-Sided PCB Assembly
Conventional double-sided PCB assembly often necessitates the use of SMT adhesives to secure components during the soldering process. These adhesives hold components in place when the board is flipped for the second reflow or wave soldering cycle, ensuring proper alignment and connectivity. However, the use of adhesives introduces additional steps, materials, and potential reliability concerns, particularly due to the differing thermal expansion properties between adhesives and electronic components.
Innovative Solution: SMT-8120 Soldering-Sintering Paste
AI Technology's SMT-8120 soldering-sintering paste addresses these challenges by integrating TLPS technology with traditional SAC solder formulations. This novel paste enables adhesive-free surface mounting by forming sintered interconnections during the initial soldering process, which do not reflow in subsequent heating cycles. Key features of SMT-8120 include:en.wikipedia.org+4en.wikipedia.org+4en.wikipedia.org+4
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Composition and Application: Based on Type 5 SAC solder with particle sizes under 25 microns, SMT-8120 utilizes a no-clean flux with a high thixotropic index, making it suitable for high-precision stencil printing and dispensing.
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Processing: The first reflow process follows conventional SAC soldering temperature profiles. Once soldered, the interconnections are sintered, preventing reflow in subsequent soldering cycles.
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Reliability: The sintered copper interconnections exhibit enhanced performance and thermal cycling stability, making SMT-8120 ideal for high-temperature applications, such as automotive electronics.
Advantages of Eliminating SMT Adhesives
By removing the need for SMT adhesives, SMT-8120 offers several benefits:
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Cost Reduction: Eliminates the expenses associated with adhesive materials, dispensing equipment, and processing time.
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Design Flexibility: Allows for the placement of active components on both sides of the PCB, reducing the overall footprint and enabling more compact designs.
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Enhanced Reliability: Avoids potential stress and reliability issues arising from the thermal expansion mismatch between adhesives and components.
Implications for the Industry
The development of SMT-8120 reflects a broader trend in the industry towards advanced packaging and high-performance materials. By integrating TLPS technology into solder pastes, manufacturers can achieve more reliable and efficient assembly processes, aligning with the increasing demands for miniaturization and performance in electronic devices.en.wikipedia.org+1reuters.com+1
Incorporating such innovations into PCB assembly processes not only streamlines manufacturing but also enhances the durability and functionality of the final products, particularly in sectors requiring high reliability under thermal stress.
For more detailed information on SMT-8120 and its applications, refer to the official press release by AI Technology, Inc.
